Light emitting diode package and method of manufacturing the same

摘要

A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the LED are formed on the PCB. The wire electrically connects the LED with the electrode pad. The first molding is formed on the LED and the second molding is formed on the first molding.

主权项

1. A light emitting apparatus comprising:
a substrate, wherein an entire top surface of the substrate is substantially planar; at least two distinct electrodes formed of at least one of Ag, Au, and Cu on the substrate, wherein at least a portion of the at least two distinct electrodes is extended to at least one end of the top surface of the substrate; a light emitting device on the substrate or one of the at least two distinct electrodes, wherein the at least two distinct electrodes are spaced from each other; and lenses including a first lens having a silicone resin and a second lens, the first lens formed on the at least two distinct electrodes, wherein the first lens has a convex-curved top surface, and wherein the second lens has a flat side surface perpendicular to the top surface of the substrate and a flat lower surface parallel to the top surface of the substrate, wherein the flat lower surface is directly connected to the flat side surface, wherein the first lens and the second lens are formed of different materials, wherein an upper surface of the first lens is substantially covered by the second lens, and wherein a maximum distance between an uppermost surface of the first lens and an uppermost surface of the second lens decreases along the uppermost surface of the first lens in a direction from the uppermost surface of the first lens to a lowermost surface of the first lens.