| 发明名称 | Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same | ||
| 摘要 | The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent. | ||
| 申请公布号 | US8963180(B2) | 申请公布日期 | 2015.02.24 |
| 申请号 | US201213570451 | 申请日期 | 2012.08.09 |
| 申请人 | Nitto Denko Corporation | 发明人 | Onishi Hidenori;Ota Shinya;Fuke Kazuhiro |
| 分类号 | H01L33/60;H01L33/56;C08L63/00;C08G59/20;C08G59/42;C08K5/06;C08K3/22;C08L63/06 | 主分类号 | H01L33/60 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. An epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition comprising the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a release agent represented by the following structural formula (I): CH3CH2kCH2—OCHRm-CHRn—OxH (1) in which each of Rm and Rn represents a hydrogen atom; k is 48; and x is 20. | ||
| 地址 | Osaka JP | ||