System and method for managing cooling airflow for a multiprocessor information handling system

摘要

Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

主权项

1. An information handling system comprising:
a chassis; a motherboard disposed in the chassis, the motherboard having plural processing component connectors operable to accept processing components and heat sink connectors operable to accept heat sinks associated with the processing components; plural processing components populating less than all of the processing component connectors, the processing components operable to process information; a fan disposed in the chassis and aligned to provide cooling airflow past the processing components; and a shroud positioned over one of the processing component connectors unpopulated by a processing component, the shroud having an exterior outer housing and an interior within the outer housing, the interior forming a channel, the channel having an inlet aligned to accept the cooling airflow into the interior and an outlet aligned to direct the cooling airflow that passes over the unpopulated processing component connector in a predetermined manner.