发明名称 Sectioned manifolds facilitating pumped immersion-cooling of electronic components
摘要 Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.
申请公布号 US8964391(B2) 申请公布日期 2015.02.24
申请号 US201313788919 申请日期 2013.03.07
申请人 International Business Machines Corporation 发明人 Campbell Levi A.;Chu Richard C.;David Milnes P.;Ellsworth, Jr. Michael J.;Iyengar Madhusudan K.;Schmidt Roger R.;Simons Robert E.
分类号 H05K7/20;F28D15/00;F28F27/00;F28F9/00;B23P15/26 主分类号 H05K7/20
代理机构 Heslin Rothenberg Farley & Mesiti P.C. 代理人 Chiu, Esq. Steven;Radigan, Esq. Kevin P.;Heslin Rothenberg Farley & Mesiti P.C.
主权项 1. A method comprising: providing a housing at least partially surrounding and forming a compartment about one or more electronic components; providing a supply manifold and a return manifold; coupling a coolant loop in fluid communication with the supply manifold, the compartment of the housing, and the return manifold, wherein a coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the one or more electronic components by, at least in part, flow boiling; coupling a pump in fluid communication with the coolant loop to facilitate circulation of the coolant within the coolant loop between the supply manifold, the compartment of the housing, and the return manifold; and coupling a coolant bypass line in fluid communication between the supply manifold and the return manifold, wherein the return manifold comprises a mixed-phase manifold section receiving coolant from the compartment of the housing and the coolant bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section of the return manifold, and wherein coolant flows from the coolant bypass line into the mixed-phase manifold section of the return manifold in a direction counter to a direction of any coolant vapor flow within the mixed-phase manifold section, the coolant flow from the coolant bypass line facilitating cooling of the coolant vapor flow.
地址 Armonk NY US