Printed wiring board and method for manufacturing same

摘要

Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, while an opening 12 formed in the metal core 11 is used as a cavity area 15a for mounting a component, wherein a reinforcement pattern 30 is formed on the surface of an insulation layer facing the bottom of the cavity area 15a in the insulation layer 16. The reinforcement pattern 30 is made of the same material as the wiring patterns 28c, 29c formed on the insulation layer 16, and also formed simultaneously with these wiring patterns 28c, 29c.

主权项

1. A printed wiring board with a cavity area capable of mounting an electronic component therein, where the cavity area is formed in a sheet-shaped metal core as a through-opening connecting two principle sides of the metal core in a location where an electronic component is to be stored, and an insulation layer is formed on and in contact with one principle side of the metal core and covers one end of the opening, forming a bottom of the cavity area;
wherein on one side of the insulation layer which does not contact the metal core and which is opposite to the side of the insulation layer facing and contacting the metal core, wiring patterns for electrically connecting electrodes of the electronic component are provided, and a conductive reinforcement pattern constituting no part of any wiring patterns and not electronically contacting the wiring patterns is formed on said one side of the insulation layer in an area corresponding to the cavity area wherein the reinforcement pattern has an outer dimension wider than the opening, surrounds said wiring patterns, and extends inward beyond a periphery of the opening of the cavity area as viewed from the one side of the insulation layer, and wherein an insulator is formed over and extends along an inner side metal surface of the cavity area, constituting a part of an innermost non-contacting surface of the cavity area perpendicular to the bottom of the cavity area, said non-contacting surface of the cavity area being out of contact with the electronic component.