发明名称 Liquid ejection apparatus and connection method for flexible wiring board
摘要 A liquid ejection apparatus includes a channel unit with a plurality of nozzles and pressure chambers configured to communicate with respective nozzles, and a plate provided on the channel unit to cover pressure chambers in a first direction from the pressure chambers, the plate comprising a plate surface extending along a second direction perpendicular to the first direction. The liquid ejection apparatus includes a plurality of drive elements arranged over the pressure chambers. The liquid ejection apparatus includes a plurality of contact terminals electrically connected to their respective drive elements at a terminal placement surface which is non-parallel with the plate surface and includes a portion of the terminal placement surface that is offset from the plate surface. The liquid ejection apparatus includes a flexible wiring board configured to be electrically connected to the contact terminals.
申请公布号 US8960863(B2) 申请公布日期 2015.02.24
申请号 US201414187405 申请日期 2014.02.24
申请人 Brother Kogyo Kabushiki Kaisha 发明人 Yamashita Toru
分类号 B41J2/14;B41J2/045;B41J2/16 主分类号 B41J2/14
代理机构 Merchant & Gould PC 代理人 Merchant & Gould PC
主权项 1. A liquid ejection apparatus, comprising: a channel unit comprising a liquid channel including a plurality of nozzles and a plurality of pressure chambers configured to communicate with respective nozzles; a plate provided on the channel unit to cover the plurality of the pressure chambers in a first direction from the pressure chambers, the plate comprising a plate surface extending along a second direction perpendicular to the first direction; a plurality of drive elements arranged over the plate in correspondence with the plurality of the pressure chambers; a plurality of contact terminals electrically connected in correspondence with respective drive elements, the plurality of the contact terminals are provided at a terminal placement surface, wherein the terminal placement surface is non-parallel with the plate surface and includes at least a portion of the terminal placement surface that is offset from the plate surface; and a flexible wiring board configured to be electrically connected to the plurality of the contact terminals.
地址 Nagoya-Shi, Aichi-Ken JP