Implementing twisted pair waveguide for electronic substrates

摘要

A method and structures are provided for implementing an impedance-matched, low inductance, 3-dimensional (3D) twisted-pair within a given dielectric material layer. A dielectric material layer is loaded with an electrically insulating metal spinel compound at a set loading level. Upon exposure to a focused laser beam, the spinel is converted to a metallic particle with an electrical conductivity suitable for various applications. An impedance-matched, low inductance, 3-dimensional (3D) twisted-pair is generated using a laser direct structuring process with a fine depth control achieved with a laser.

主权项

1. A method for implementing a twisted-pair structure within a given dielectric material layer comprising:
providing a dielectric material layer within an electronic packaging; loading the dielectric material layer with an electrically insulating metal spinel compound at a set loading level; and using a laser direct structuring process exposing the electrically insulating metal spinel compound to a focused laser beam, converting the spinel to a metallic particle with a set electrical conductivity for generating a twisted-conductor pair structure.