发明名称 Phenol resin molding material and pulley molded from said molding material
摘要 Disclosed is a phenol resin molding material comprising 100 parts by weight of a resol type phenol resin, 40 to 100 parts by weight of an inorganic fiber, 30 to 90 parts by weight of a natural silica powder having an average particle size of 0.5 to 15 μm and subjected to a coupling agent treatment and 1 to 15 parts by weight of a rubber component as main components. The molding material can contain 50% by weight or more of a glass fiber and a natural silica powder having a crushed shape can be used as the natural silica powder. As a molded article produced from the resin molding material, a resin pulley is exemplified.
申请公布号 US8962734(B2) 申请公布日期 2015.02.24
申请号 US200510591516 申请日期 2005.01.25
申请人 JTEKT Corporation 发明人 Arai Hirokazu;Asai Keiji
分类号 C08K7/18;C08K7/14;C08L61/06;C08L9/02;C08L21/00;C08L35/04;F16H55/48 主分类号 C08K7/18
代理机构 Christie, Parker & Hale, LLP. 代理人 Christie, Parker & Hale, LLP.
主权项 1. A resin pulley molded with a phenol resin molding material, the phenol resin molding material comprising 100 parts by weight of a resol phenolic resin, 40 to 100 parts by weight of an inorganic fiber, 30 to 90 parts by weight of a natural silica powder having an average particle size of 0.5 to 15 μm and subjected to a coupling agent treatment and 1 to 15 parts by weight of a rubber component as main components, wherein the inorganic fiber contains 50% by weight or more of a glass fiber, wherein the natural silica powder has a crushed shape, wherein the coupling agent is present in an amount of from 0.5 to 3 parts by weight based on 100 parts by weight of the silica powder and is selected from the group consisting of vinyltrichlorosilane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, β(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, isopropyltriisostearoyl titanate, tetraoctylbis(ditridecylphosphite)titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl)phosphate titanate, isopropyltri(N-aminoethyl-aminoethyl) titanate, bis(dioctyl pyrophosphate)oxyacetate titanate, isopropyltrioctanoyl titanate, isopropyltris(dioctylpyrophosphate)titanate, isopropyldimethacrylisostearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyldiacryl titanate, tetraisopropylbis(dioctylphosphite)titanate, isopropyltricumylphenyl titanate, and combinations thereof.
地址 Osaka JP