发明名称 Extruded frame structures to house a conductor
摘要 Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed.
申请公布号 US8963004(B2) 申请公布日期 2015.02.24
申请号 US201012725364 申请日期 2010.03.16
申请人 SAPA Extrusions, Inc. 发明人 Goody Ray
分类号 H01B7/00;B21C23/22;B21C23/14;H02G5/02;H02G3/04;H03G3/18 主分类号 H01B7/00
代理机构 Loeb & Loeb LLP 代理人 Loeb & Loeb LLP
主权项 1. An apparatus comprising: an extruded frame structure having a frame profile; a first region of the frame profile configured to substantially surround a first conductor disposed therein, said first conductor being at least partially disposed in a first insulator to electrically insulate the first conductor from the extruded frame structure, the first insulator being disposed in the first region of the frame profile except for an area where the first insulator is exposed; one or more couplers in the frame profile to facilitate coupling of one or more electrical devices to the extruded frame structure, wherein the one or more couplers comprise one or more recessed regions, the one or more recessed regions being disposed in a surface of the frame profile adjacent to the area where the first insulator is exposed; and one of the one or more electrical devices coupled to the extruded frame structure using the one or more recessed regions, the one of the one or more electrical devices comprising an electrically conductive protrusion to form an electrical connection for the electrical device; wherein the electrically conductive protrusion is electrically coupled to the first conductor through the area where the first insulator is exposed.
地址 Rosemont IL US