Light emitting diode package

摘要

An LED package includes a package body having a well formed in its upper surface, where the well is configured to receive a light emitting chip. An optical lens is disposed above the package body and includes a hollow dome structure located above and encompassing the lateral extent of the light emitting chip within the well of the package body. In one implementation, the package body and the optical lens collectively include at least one protrusion and concave, where the protrusion is aligned with the concave so that the optical lens mates with the package body, thereby causing the optical lens to self align with the package body. In another implementation, a protruding inner portion of the upper surface of the package body mates with the hollow dome structure, achieving a similar purpose. Consequently, generation of an eccentric fault between the optical lens and the package body is prevented.

主权项

1. A light emitting diode package comprising:
a package body including a well formed in an upper surface of the package body, the well configured to receive a light emitting chip; an optical lens disposed above the package body and including a hollow dome structure disposed above the light emitting chip and at least a part of the package body; a plurality of concaves formed in the upper surface of the package body; and a plurality of protrusions formed in a rear surface of the optical lens opposite to the plurality of concaves, the plurality of protrusions shaped to fit within the plurality of concaves such that the rear surface of the optical lens mates with the upper surface of the package body, thereby causing the optical lens to self align with the package body.