Semiconductor chip probe and the conducted EME measurement apparatus with the semiconductor chip probe

摘要

The present invention discloses a semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die and a conducted EME measurement apparatus with the semiconductor chip probe. The semiconductor chip probe comprises a substrate, a dielectric layer, an impedance unit, a measuring unit and a connection unit. The measurement apparatus comprises a semiconductor chip probe, a high frequency probe, a signal cable and a test receiver. The integrated passive component network designed and embedded inside the semiconductor chip probe forms the 1Ω or 150Ω impedance network. And the semiconductor chip probe is able to directly couple the EME conducted current or voltage from the test pin of the flipped chip under test to the test receiver for measurement.

主权项

1. A semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die, having:
a substrate; a dielectric layer, being formed on and covering a surface of the substrate; an impedance unit, being accommodated within the dielectric layer and consisting of a passive component network as well as a first metal wire, a second metal wire and a third metal wire that extend from the passive component network, wherein the third metal wire is electrically grounded; a measuring unit, having a test pad and a plurality of metal pads that expose the dielectric layer, wherein the test pad has a metal ball disposed thereon, the metal ball is electrically connected with a pad under test of a flipped chip and inputs a measurement signal from the pad under test, and the test pad is in signal connection with the first metal wire; and a connection unit, being formed by a signal pad and two ground pads that are disposed at two sides of the signal pad respectively, wherein the signal pad and the two ground pads are not contacted with each other and all expose the dielectric layer, the signal pad is electrically connected with the second metal wire, and the two ground pads are electrically grounded.