| 发明名称 | Heat-transfer structure | ||
| 摘要 | An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305. | ||
| 申请公布号 | US8963323(B2) | 申请公布日期 | 2015.02.24 |
| 申请号 | US200812143594 | 申请日期 | 2008.06.20 |
| 申请人 | Alcatel Lucent | 发明人 | Kempers Roger Scott;Krishnan Shankar;Lyons Alan Michael;Salamon Todd Richard |
| 分类号 | H01L23/31;H01L23/00;H01L23/42;H01L23/367;H01L25/065;B21D53/02 | 主分类号 | H01L23/31 |
| 代理机构 | Hitt Gaines, PC | 代理人 | Hitt Gaines, PC |
| 主权项 | 1. An apparatus, comprising: a first substrate having a first surface; a second substrate having a second surface facing the first surface; and an array of metallic raised features being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle deformation produced therein via a compressive force, wherein the mechanical bend or buckle deformation via the compressive force produces a compressive pressure in a range of 0.7 to 4.2 MPa. | ||
| 地址 | Boulogne-Billancourt FR | ||