发明名称 |
Methods and apparatus for electrically modifying gel adhesion |
摘要 |
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process. |
申请公布号 |
US8961738(B2) |
申请公布日期 |
2015.02.24 |
申请号 |
US201213570299 |
申请日期 |
2012.08.09 |
申请人 |
Polytechnic Institute of New York University |
发明人 |
Barinov Victor;Levon Kalle |
分类号 |
B32B38/10;C09J5/00 |
主分类号 |
B32B38/10 |
代理机构 |
Frommer Lawrence & Haug LLP |
代理人 |
Frommer Lawrence & Haug LLP ;Frommer William S. |
主权项 |
1. A method for disbonding an adhesive bond between an electric-field-responsive material and a substrate, comprising:
applying an electric field to reduce the strength and integrity of said adhesive bond; wherein said electric-field-responsive material comprises a polymeric material and a solvent; and wherein said electric field is applied before said solvent is removed. |
地址 |
Brooklyn NY US |