Three dimensional image pick-up device and manufacturing method thereof

摘要

A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.

主权项

1. A 3-D image pick-up device, comprising:
two camera modules, each camera module including an image sensor; a PCB (Printed Circuit Board) mounted with the two camera modules; a reinforcing member including two exposure windows correspondingly formed at positions of the two camera modules; and at least one rib formed between the two exposure windows, wherein the two camera modules are disposed on an upper surface of the PCB, wherein the reinforcing member is coupled to the upper surface of the PCB and configured to prevent the PCB from being bent, wherein each of the two camera modules is discrete from the other camera module, wherein a connector unit is mounted at an area of the PCB between the two camera modules, and wherein the reinforcing member is formed with an opening window having an opening at a portion corresponding to a position of the connector unit mounted at the PCB.