发明名称 Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head
摘要 A liquid droplet ejecting head includes: a base substrate that has a concave portion that is formed to be open toward an upper surface and a wiring pattern; and an IC package that is electrically connected to the wiring pattern. The concave portion has a bottom portion and a pair of first side wall portions which stand obliquely on the bottom portion so as to be opposed to each other. Further, the wiring pattern has a plurality of linear objects, each of which is continuous and is constituted of a first part, a second part, and a third part. In addition, the IC package is formed in a chip shape, has a plurality of terminals which are formed on a front side surface, and is disposed such that the front side surface faces the concave portion, and each terminal is electrically connected to the first part.
申请公布号 US8960861(B2) 申请公布日期 2015.02.24
申请号 US201314035558 申请日期 2013.09.24
申请人 Seiko Epson Corporation 发明人 Yoda Tsuyoshi;Miyazawa Ikuya;Sugita Hiroshi
分类号 B41J2/14;B41J2/16;B41J2/045;H01L49/00 主分类号 B41J2/14
代理机构 Workman Nydegger 代理人 Workman Nydegger
主权项 1. A liquid droplet ejecting head comprising: a base substrate of a plate-like body that has a concave portion that is formed to be open toward one surface and a wiring pattern made of a conductive material; and an IC package that is electrically connected to the wiring pattern, wherein the concave portion has a bottom portion and two side wall portions, which stand on the bottom portion so as to be opposed to each other, and the two side wall portions are inclined such that a separation distance between the two side wall portions gradually increases toward the one surface side, wherein the wiring pattern has a plurality of linear objects, each of which is continuous and is constituted of a first part formed on the one surface, a second part formed on the side wall portion, and a third part formed on the bottom portion, and wherein the IC package is formed in a chip shape, has a plurality of terminals which are formed on a surface opposed to the concave portion, is mounted across the concave portion, and each terminal is electrically connected to the first part.
地址 Tokyo JP