| 发明名称 |
PERFECTIONNEMENT AUX CIRCUITS A FILMS EPAIS |
| 摘要 |
1,274,782. Soldering. STANDARD TELEPHONES & CABLES Ltd. 19 April, 1971 [6 Feb., 1970], No. 5824/70. Heading B3R. [Also in Division H1] Tin-free solder is used for attaching electrical components to a thick film circuit in order to reduce degradation of the adhesion between conductors and the insulating substrate. Suggested solders include lead-bismuth, leadindium and lead-cadmium (70-80% Pb, 30- 20% Cd). |
| 申请公布号 |
BE762622(A1) |
申请公布日期 |
1971.08.09 |
| 申请号 |
BE19710762622 |
申请日期 |
1971.02.08 |
| 申请人 |
INTERNATIONAL STANDARD ELECTRIC CORP, 320, PARK AVENUE, NEW YORK 22, N.Y., E.U.A., |
发明人 |
W.A. CROSSLAND;C.A. MARR;L. HAILES;STANDARD TELEPHONES AND CABLES LTD. |
| 分类号 |
H01L23/498;H05K1/09;H05K3/34;(IPC1-7):05K/ |
主分类号 |
H01L23/498 |
| 代理机构 |
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