Ink-jet head and ink-jet drawing device including same

摘要

An actuator included in a head substrate of an ink-jet head receives, with an electrode on the surface of the actuator, power fed from the wiring of a wiring substrate arranged opposite the head substrate. A first electrode of the wiring substrate is electrically connected to the wiring, and protrudes to the side of the head substrate. A second electrode is electrically connected to the electrode on the surface of the actuator, protrudes to the side of the wiring substrate and is electrically connected to the first electrode. The head substrate and the wiring substrate are adhered to each other through an adhesive layer such that a space to which the first electrode and the second electrode are exposed is hermetically sealed. The hermetically sealed space is in a vacuum state or is filled with a gas containing a predetermined amount of water or less.

主权项

1. An ink-jet head comprising:
a wiring substrate having a wiring; and a head substrate including
a pressure chamber that holds an ink,a nozzle that serves as a discharge hole of the ink within the pressure chamber, andan actuator that receives, with an electrode on a surface, power fed from the wiring of the wiring substrate and that discharges the ink within the pressure chamber through the nozzle, wherein the wiring substrate includes a first electrode that is electrically connected to the wiring and that protrudes to a side of the head substrate, wherein the actuator includes a second electrode that is electrically connected to the electrode, that protrudes to a side of the wiring substrate and that is electrically connected to the first electrode, wherein the head substrate and the wiring substrate are adhered to each other through an adhesive layer such that a space to which the first electrode and the second electrode are exposed is hermetically sealed, wherein the hermetically sealed space is in a vacuum state or is filled with a gas containing a predetermined amount of water or less, wherein the adhesive layer is formed with a thermosetting adhesive resin layer, and wherein a melting point of one of the first electrode and the second electrode is equal to or less than a curing temperature when the head substrate and the wiring substrate are joined together with the thermosetting adhesive resin layer.