| 摘要 |
<p>The present invention relates to a semiconductor device testing system. The semiconductor device testing system comprises: a socket guide including a first opening disposed on a central portion and into which a socket having a plurality of test terminals is inserted, a plurality of socket guide parts which protrude upward from an upper surface adjacent to each edge of the first opening, and have a first surface that is disposed so as to be adjacent to the upper surface and has a non-inclined surface, and a second surface that is disposed above the first surface and inclined toward the fist opening; and a carrier module including a second opening disposed so as to correspond to the first opening, and in which a semiconductor device is disposed, and a plurality of grooves into which the guide parts are respectively inserted. Therefore, a location of a semiconductor device, which is tested through a contact with the socket by the guide part formed in the socket guide, is corrected, so that an alignment error of the socket and the semiconductor device can be reduced.</p> |
