| 发明名称 | Printhead die | ||
| 摘要 | A printhead die is provided that includes a substrate and a slot extending through the substrate, the slot including a first slot segment and a discrete second slot segment, the second slot segment being offset from the first slot segment along a major axis and along an orthogonal minor axis. | ||
| 申请公布号 | US8960860(B2) | 申请公布日期 | 2015.02.24 |
| 申请号 | US201114113225 | 申请日期 | 2011.05.31 |
| 申请人 | Hewlett-Packard Development Company, L.P. | 发明人 | Axtell James P.;Torgerson Joseph M.;Benjamin Trudy |
| 分类号 | B41J2/17;B41J2/14;B41J2/16;B41J2/155 | 主分类号 | B41J2/17 |
| 代理机构 | Hewlett-Packard Patent Department | 代理人 | Hewlett-Packard Patent Department ;Karnstein Walt |
| 主权项 | 1. A printhead die, comprising: a substrate; and a slot extending through the substrate, the slot including a first slot segment and a discrete second slot segment, the second slot segment being offset from the first slot segment along a major axis and along an orthogonal minor axis; wherein the offset between the first slot segment and the second slot segment defines a pathway between the first slot segment and the second slot segment and through which an electrical trace is routed across the substrate through the pathway. | ||
| 地址 | Houston TX US | ||