| 发明名称 | Method of bonding solid materials | ||
| 摘要 | Improved methods of bonding solid materials include a step of fabricating a micro-column array (MCA) on at least one surface to be bonded. The MCA formation process can be modified to cause and/or prevent chemical alteration of the surface being treated or to deposit a coating on the surface. In a preferred embodiment, the MCA is fabricated by laser treating the surface, such as by laser ablation. | ||
| 申请公布号 | US8962151(B2) | 申请公布日期 | 2015.02.24 |
| 申请号 | US200711891429 | 申请日期 | 2007.08.10 |
| 申请人 | Integrated Micro Sensors, Inc. | 发明人 | Starikov David;Bensaoula Abdelhak |
| 分类号 | B23K26/00;B23K1/00;B23K1/20;B23K26/06;B23K26/36;C04B37/02;C09J5/02 | 主分类号 | B23K26/00 |
| 代理机构 | Cooke Law Firm | 代理人 | Cooke, Jr. Claude E.;Cooke Law Firm |
| 主权项 | 1. A method for bonding a first object to a second object comprising: forming a micro-column array on a surface of at least one of the objects wherein the micro-column array is formed by laser treatment of the surface; providing a source of heat separate from the laser used to treat the surface of at least one of the objects; preheating the surface with the source of heat prior to or concurrently with the laser treatment; positioning a bonding material between the first and second objects; and bonding the first object to the second object. | ||
| 地址 | Houston TX US | ||