Method for the deposition of a metal layer comprising a beta-amino acid

摘要

The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5, and in which instead a β-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of β-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.

主权项

1. A method for the electroless deposition of a metal layer on a substrate comprising contacting the substrate to be plated with a plating formulation comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, an accelerator, and a β-amino acid and/or β-amino acid derivative as stabilizer, wherein the β-amino acid is present within a range of 1 mg/L to 2 g/L and wherein the metal to be deposited comprises nickel, copper, cobalt, boron, or gold, or an alloy of nickel, copper, cobalt, boron, or gold.