Method and device for cleaning semiconductor substrate

摘要

According to one embodiment, a method for cleaning a semiconductor substrate comprises supplying water vapor to a surface of a semiconductor substrate on which a concave-convex pattern is formed while heating the semiconductor substrate at a predetermined temperature, cooling the semiconductor substrate after stopping the heating and the supply of the water vapor and freezing water on the semiconductor substrate, after freezing the water, supplying pure water onto the semiconductor substrate and melting a frozen film, and after melting the frozen film, drying the semiconductor substrate.

主权项

1. A method for cleaning a semiconductor substrate, comprising:
supplying water vapor to a surface of a semiconductor substrate on which a concave-convex pattern is formed while heating the semiconductor substrate at a predetermined temperature, to form an adsorbed water layer; stopping the heating and the supply of the water vapor so that the surface of the adsorbed water layer has a concave and convex pattern matching the concave-convex pattern formed on the surface of the semiconductor substrate, and subsequently cooling the semiconductor substrate to freeze water on the semiconductor substrate; after freezing the water, supplying pure water onto the semiconductor substrate and melting a frozen film; and after melting the frozen film, drying the semiconductor substrate.