| 摘要 |
<p>The present invention provides a multilayer ceramic electronic component embedded on the substrate which includes a ceramic body which includes a dielectric layer, first and second main surfaces to face each other, first and second lateral surfaces to face each other, and first and second cross sections to face each other, first and second internal electrodes which are alternatively exposed through both cross sections of the ceramic body by interposing the dielectric layer, first and second external electrodes which are formed on both cross sections of the ceramic body. The first external electrode includes a first bottom electrode which is electrically connected to the first internal electrode, a first intermediate layer which is formed on the first bottom electrode and is made of Ni, and a first terminal which is formed on the first intermediate layer. The second external electrode includes a second bottom electrode which is electrically connected to the second internal electrode, a second intermediate layer which is formed on the bottom electrode and is made of Ni, and a second terminal electrode which is formed on the second intermediate layer. The first and second bottom electrodes include first conductive metal and glass. The first and second terminal electrodes are made of second conductive metal.</p> |
