发明名称 EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
摘要 <p>The present invention provides a multilayer ceramic electronic component embedded on a substrate which includes a ceramic body which includes a dielectric layer, first and second main surfaces to face each other, first and second lateral surfaces to face each other, and first and second cross sections to face each other, a first internal electrode which is formed on the ceramic body and includes a first lead-out part and a second lead-out part which are exposed to the first and second lateral surfaces of the ceramic body, a second internal electrode which is exposed to the first and second lateral surfaces of the ceramic body and includes a third lead-out part and a fourth lead-out part which are separated from the first and second lead-out parts with a preset distance, a first polarity external electrode which is extended to the first and second main surfaces on both sides of the ceramic body and is connected to the first and second lead-out parts of the first internal electrode, and a second polarity external electrode which is connected to the third and fourth lead-out parts of the second internal electrode. The number of the first and second polarity external electrodes is 2 or more, respectively. The first and second polarity external electrodes include first and second polarity bottom electrodes and first and second polarity terminal electrodes which are formed on the first and second polarity bottom electrodes. If the length of the ceramic body is L and the width thereof is W, W/L>=0.6 is satisfied. If the width of the first and second external electrodes formed on the first and second main surfaces is BW, 150μm<=BW<=350μm is satisfied.</p>
申请公布号 KR20150018137(A) 申请公布日期 2015.02.23
申请号 KR20130094686 申请日期 2013.08.09
申请人 发明人
分类号 H01G4/12;H01G4/30;H05K3/46 主分类号 H01G4/12
代理机构 代理人
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