发明名称 ELECTRONIC APPARATUS COVER, ANTENNA ASSEMBLY, ELECTRONIC APPARATUS, AND PROCESS OF MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic apparatus cover, an antenna assembly, an electronic apparatus, and a process of manufacturing the same.SOLUTION: The electronic apparatus cover includes: a metal plate having a first metal area composed of a metal material; a through-hole formed in part of an area of the first metal area on the metal plate; and an electric open path formed from the through-hole to the first metal area.</p>
申请公布号 JP2015037326(A) 申请公布日期 2015.02.23
申请号 JP20140164715 申请日期 2014.08.13
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JEON DAE SEONG;KIM JONG LAE;CHOI KANG RYONG
分类号 H01Q1/44;H01Q7/00;H04M1/02 主分类号 H01Q1/44
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