发明名称 |
ELECTRONIC APPARATUS COVER, ANTENNA ASSEMBLY, ELECTRONIC APPARATUS, AND PROCESS OF MANUFACTURING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic apparatus cover, an antenna assembly, an electronic apparatus, and a process of manufacturing the same.SOLUTION: The electronic apparatus cover includes: a metal plate having a first metal area composed of a metal material; a through-hole formed in part of an area of the first metal area on the metal plate; and an electric open path formed from the through-hole to the first metal area.</p> |
申请公布号 |
JP2015037326(A) |
申请公布日期 |
2015.02.23 |
申请号 |
JP20140164715 |
申请日期 |
2014.08.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JEON DAE SEONG;KIM JONG LAE;CHOI KANG RYONG |
分类号 |
H01Q1/44;H01Q7/00;H04M1/02 |
主分类号 |
H01Q1/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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