| 摘要 |
In the conventional collet, a die may be damaged when the die is replaced in a middle stage. In addition, a DAF may be degraded. Therefore, the present invention provides a collet and a die bonder of which the die is not damaged and the DAF is not degraded when the die is picked up from a wafer and is replaced in the middle stage. The present invention comprises: a flat adsorption surface to adsorb the upper surface of the die and a collet top end part having a foot surrounding the side surface of the adsorbed die, wherein the depth of the foot of the collet top end part is thicker than the thickness of the die. |
