| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce voids in a bonding material in surface mounting.SOLUTION: A semiconductor device of the present embodiment comprises: a lead frame having die pads and terminals; a semiconductor chip mounted on an upper surface of each die pad; and a resin encapsulation body which covers the semiconductor chip, the die pad and upper surfaces of the terminals. An under surface of the die pad is arranged in a plane the same with an under surface of the resin encapsulation body and exposed on the under surface of the resin encapsulation body. The under surface of the die pad and the under surface of the resin encapsulation body are entirely formed by a gentle curve toward an upper surface of the resin encapsulation body with the center point of the resin encapsulation body at the top. The semiconductor device comprises four die pads each including beveled parts in parts which contact each other.</p> |
