发明名称 RESIN MOLDING MOLD AND DESIGNING METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin molding mold which has a molding surface with uniform temperature and besides can be easily manufactured at low cost, and a designing method thereof.SOLUTION: The resin molding mold includes a stationary side mold 11, a movable side mold 12 and heat sources 3 for mold heating which are installed in the stationary side mold 11 and the movable side mold 12 respectively and heat the stationary side mold 11 and the movable side mold 12 respectively. In each of the stationary side mold 11 and the movable side mold 12, distance ht (unit is m) between the heat resource 3 for mold heating and the molding surface 5 satisfies the formula 0.001≤ht≤ΔT×k/q, whereΔT is a difference between temperature at an installing position of the heat resource 3 for mold heating (unit is K) and temperature at the molding surface 5, k is a heat conductivity of a raw material constituting the stationary side mold 11 and the movable side mold 12 (unit is W/m K), and q is a heat flux of the heat resource 3 for mold heating (unit is W/m).</p>
申请公布号 JP2015036230(A) 申请公布日期 2015.02.23
申请号 JP20130168620 申请日期 2013.08.14
申请人 FUJI ELECTRIC CO LTD;FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 SUGATA YOSHINOBU
分类号 B29C33/02;B29C45/26 主分类号 B29C33/02
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