| 摘要 |
The present invention is a multiple chip LED package, comprising: LED chips electrically connected to a wiring pattern of a PCB; a diffusing plate which provides space for insertion of said LED chips and which diffuses light emitted from said LED chips to achieve surface light emission; a diffusing means disposed above said LED chips to reflect light emitted from upper portions thereof; a first reflection layer for reflecting incident light from the boundary surface between said PCB and said diffusing plate; and a heat-dissipating metal plate, having protrusions which are inserted into a plurality of through-holes, formed in said PCB in such a way that said LED chips are mounted on said protrusions, and which directly dissipates heat generated from said LED chips. The advantage of the present invention is that unpackaged LED chips can be packaged within the diffusing plate, allowing said diffusing plate to uniformly and simultaneously distribute and diffuse light, thereby reducing both the thickness of a backlight unit and the manufacturing costs. |
