| 摘要 |
<p>The purpose of the present invention is to provide an epoxy resin composition and a cured product thereof that have excellent performance in terms of low dielectricity and high heat resistance and are useful in uses such as stacking, molding, casting and bonding. Provided are an epoxy resin composition contains epoxy resin (A) represented by general formula (1) and a curing agent (B) and a cured product thereof. In chemical formula 1, m represents a repetition count, the mean value of which satisfies 0<m<10; n represents a repetition count, the mean value of which satisfies 0<=n<10; X respectively and independently represents one among a naphthylene group, a naphthylene group having a C1-10 hydrocarbon group or a halogen atom as a substituent and a group represented by general formula (2); Y respectively and independently represents one among a phenylene group, a naphthylene group, a phenylene group having a C1-10 hydrocarbon group or a halogen atom as a substituent, a naphthylene group having a C1-10 hydrocarbon group or a halogen atom as a substituent and a group represented by general formula (2); and G represents a glycidyl group.</p> |
