| 摘要 |
<p>Disclosed is a substrate cleaning apparatus capable of removing photoresist to which an ion with high density is injected by efficiently heating SPM chemical solutions. The substrate cleaning apparatus includes a chamber which receives a substrate, a spin chuck which is formed in the chamber and rotates by gripping the substrate, a nozzle part which is formed to cover the upper side of the substrate gripped by the spin chuck and includes a plurality of spray holes for spraying the chemical solutions on the substrate and a cover part which includes a heater to heat the chemical solutions sprayed through the nozzle part.</p> |
