发明名称 LEAD FRAME, MULTIFACETED BODY OF LEAD FRAME, LEAD FRAME WITH RESIN, MULTIFACETED BODY OF LEAD FRAME WITH RESIN, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a lead frame capable of improving strength of corners of an optical semiconductor device, and also to provide a multifaceted body of the lead frame, a lead frame with resin, a multifaceted body of the lead frame with resin, and a multifaceted body of the optical semiconductor device.SOLUTION: A lead frame 10 has a plurality of terminal parts 11 and 12 and is used in an optical semiconductor device 1. At least one of corners of a region where a light reflection resin layer 20 is formed is equipped with a reinforcement part T1 separated from the terminal parts 11 and 12.
申请公布号 JP2015037101(A) 申请公布日期 2015.02.23
申请号 JP20130167716 申请日期 2013.08.12
申请人 DAINIPPON PRINTING CO LTD 发明人 YAZAKI MASAKI;MIYANO KAZUYUKI;NAKAMURA MAKOTO;UCHIYA NAOYUKI;ODA KAZUNORI
分类号 H01L33/62;H01L23/50 主分类号 H01L33/62
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