发明名称 |
LEAD FRAME, MULTIFACETED BODY OF LEAD FRAME, LEAD FRAME WITH RESIN, MULTIFACETED BODY OF LEAD FRAME WITH RESIN, AND OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame capable of improving strength of corners of an optical semiconductor device, and also to provide a multifaceted body of the lead frame, a lead frame with resin, a multifaceted body of the lead frame with resin, and a multifaceted body of the optical semiconductor device.SOLUTION: A lead frame 10 has a plurality of terminal parts 11 and 12 and is used in an optical semiconductor device 1. At least one of corners of a region where a light reflection resin layer 20 is formed is equipped with a reinforcement part T1 separated from the terminal parts 11 and 12. |
申请公布号 |
JP2015037101(A) |
申请公布日期 |
2015.02.23 |
申请号 |
JP20130167716 |
申请日期 |
2013.08.12 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YAZAKI MASAKI;MIYANO KAZUYUKI;NAKAMURA MAKOTO;UCHIYA NAOYUKI;ODA KAZUNORI |
分类号 |
H01L33/62;H01L23/50 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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