| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy sheet having high strength, high conductivity, high bending deflection coefficient and excellent stress relaxation characteristics, and to provide an electronic component for large current use or for heat-radiating use.SOLUTION: There is provided a copper alloy sheet which contains 0.8 to 5.0 mass% of one or more of Ni and Co, 0.2 to 1.5 mass% of Si and the balance copper with inevitable impurities. The copper alloy sheet has a tensile strength of 500 MPa or more, and the A value, given by the following expression, which is 0.5 or more. A=2X+X-XX=I/I(provided that Iand Iare the diffraction integral strengths, obtained by X-ray diffraction method, of the (hkl) plane obtained with respect to the rolling plane and the copper powder, respectively.) |
