| 摘要 |
<p>The present invention relates to a chemical conversion treatment composition for a printed circuit board and a chemical conversion treatment method using the same. The chemical conversion treatment composition includes 1-20 wt% of sulfuric acid, 1.0-10 wt% of hydrogen peroxide, 0.1-20 wt% of azo compound, 0.01-1 wt% of chloride compound, 0.1- 5 wt% of wetting agent, and extra water. The chemical conversion treatment composition for a printed circuit board can solve the existing problem of an acidic chemical conversion treatment process and form reddish brown organic chemical conversion treatment excellent in adhesion strength and acid resistance by including an azo compound.</p> |
