| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection apparatus inspecting the quality of conduction and insulation in a printed circuit board, which does not need to consider warpage or torsion of the printed circuit board and can simultaneously inspect both sides of the printed circuit board.SOLUTION: An inspection apparatus 1 inspects a printed circuit board 2 placed on a flat-shaped tray 3 while sandwiching the board between an upper inspection jig 4 and a lower inspection jig 5. In the inspection, a lifting and lowering unit 6 is used to lower the upper inspection jig 4, and the printed circuit board 2 placed on the flat-shaped tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. In this state, an inspection pin provided on the upper inspection jig 4 is brought into contact with wiring formed on the top surface of the printed circuit board 2, and conduction or insulation between the inspection pin and the wiring is inspected. |
