发明名称 IMAGE SENSOR MODULE REDUCING ENTIRE THICKNESS AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an image sensor module which reduces its entire thickness, and to provide a manufacturing method of the image sensor module.SOLUTION: An image sensor module includes: an image sensor unit including an image sensor element having an image sensor region on its upper surface; a translucent unit including a translucent element which is supported above the image sensor element through multiple support mediums; a substrate unit including a flexible substrate which is installed on the image sensor element through multiple conductors and is electrically connected with the image sensor element; and a lens unit including a non-translucent frame, which is installed on the flexible substrate and is used for covering the translucent element, and a lens element which is connected with the non-translucent frame and is installed above the translucent element.
申请公布号 JP2015037309(A) 申请公布日期 2015.02.23
申请号 JP20130214457 申请日期 2013.10.15
申请人 AZUREWAVE TECHNOLOGIES INC 发明人 HSU CHI-HSING
分类号 H04N5/225;G02B7/02;H04N5/335 主分类号 H04N5/225
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