| 摘要 |
<p>A chip electronic component according to one embodiment of the present invention includes a ceramic body, an external electrode which is formed on both ends of the longitudinal direction of the ceramic body, and an interposer which supports the ceramic body and is electrically connected to the external electrode. The interposer includes a first electrode pad with the external electrode arranged on one side thereof, a second electrode pad which is formed on the opposite side of one side, and a connection electrode pad which connects the first electrode pad to the second electrode pad and is formed on a lateral side between one side and the opposite side. The first electrode pad is separated by a space and includes a first electrode pattern and a second electrode pattern which are formed on both ends based on the space. A non-polar margin part is formed between the end of the longitudinal direction of the first electrode pad and the end of the longitudinal direction of the interposer. The connection electrode pad is formed on the lateral side of the interposer to form the space.</p> |
