MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component for incorporating board and a printed circuit board incorporating the multilayer ceramic electronic component.SOLUTION: A multilayer ceramic electronic component comprises a ceramic body; a first internal electrode and a second internal electrode which have a first lead-out part and a second lead-out part formed inside the ceramic body; first and second external electrodes formed on both side ends of the ceramic body and connected to the first internal electrode; and a third external electrode formed on upper and lower surfaces of the ceramic body and connected to the second internal electrode. First to third external electrodes include first to third base electrodes and first to third terminal electrodes formed on first to third base electrodes, respectively. The outermost side first internal electrode in first internal electrodes, is connected to first and second base electrodes via one or more first vias extended and formed on at least one of first and second main surfaces of the ceramic body, and the second internal electrode is connected to the third base electrode via one or more second vias extended and formed on at least one of first and second main surfaces of the ceramic body.