CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a ceramic circuit board and an electronic device, capable of suppressing occurrence of a compression stress and a tensile stress associated with a thermal stress on a ceramic substrate even when a metal plate on the side on which at least a power semiconductor is mounted is thickened and also suppressing occurrence of warp, and improving heat dissipation.SOLUTION: The ceramic circuit board comprises a ceramic substrate 12 and a first metal plate 14 bonded to a surface 12a of the ceramic substrate 12. The size of the surface 12a of the ceramic substrate 12 is smaller than the size of a surface (first facing surface 14a) on the side facing the ceramic substrate 12 of the first metal plate 14.