发明名称 METHOD FOR MAKING A REDISTRIBUTED ELECTRONIC DEVICE USING A TRANSFERRABLE REDISTRIBUTION LAYER
摘要 <p>A method of making an electronic device with a redistribution layer includes providing an electronic device having a first pattern of contact areas, and forming a redistribution layer on a temporary substrate. The temporary substrate has a second pattern of contact areas matching the first pattern of contact areas, and a third pattern of contact areas different than the second pattern of contact areas. The second pattern of contact areas is coupled to the third pattern of contact areas through a plurality of stacked conductive and insulating layers. The first pattern of contact areas is coupled to the second pattern of contact areas on the transferrable redistribution layer. The temporary substrate is then removed to thereby form a redistributed electronic device.</p>
申请公布号 KR101495014(B1) 申请公布日期 2015.02.23
申请号 KR20147020488 申请日期 2013.01.29
申请人 发明人
分类号 H01L21/66;H01L21/683;H01L21/768;H01L23/522 主分类号 H01L21/66
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