发明名称 FLUX FOR RESIN FLUX CORED SOLDER AND RESIN FLUX CORED SOLDER
摘要 <p>PROBLEM TO BE SOLVED: To provide flux for resin flux cored solder which is excellent in storage stability and productivity and contains thermosetting resin and to provide resin flux cored solder made by incorporating the flux for resin flux cored solder.SOLUTION: There is provided flux for resin flux cored solder includes first solid-state flux 11 containing a thermosetting resin and second solid-state flux 12 containing a curing agent having a redox actuation, where the first flux 11 and the second flux 12 exist in a non-contact state. Also provided is resin flux cored solder 100a which includes the flux for resin flux cored solder and a lead-free solder alloy of which melting point is 130 to 250°C, and is composed of the first resin flux cored solder 21 made by incorporating the first flux 11 into the lead-free solder alloy 2 and the second resin flux cored solder 22 made by incorporating the second flux 12 into the lead-free solder alloy 2.</p>
申请公布号 JP2015033714(A) 申请公布日期 2015.02.19
申请号 JP20130166281 申请日期 2013.08.09
申请人 FUJI ELECTRIC CO LTD;FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 KARIBE TATSUYA;WATANABE HIROHIKO
分类号 B23K35/363;B23K35/14 主分类号 B23K35/363
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