| 摘要 |
<p>PROBLEM TO BE SOLVED: To properly perform thermal treatment of a substrate where multiple circuits are formed on a surface while simplifying the structure of a thermal treatment device.SOLUTION: A second thermal treatment device 34 includes: a processing container 230 which houses multiple wafers W; multiple heating plates 240 which are provided at multiple tiers in the processing container 230 and hold the respective wafers W to perform thermal treatment to the wafers W; a gas supply mechanism 231 which supplies an inactive gas to the processing container 230; and a wafer transfer mechanism 221 which transfers the wafers W to the multiple heating plates 240. The gas supply mechanism 231 includes a heater 235 which heats the inactive gas to be supplied to the processing container 230.</p> |
