发明名称 |
METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA ETCH |
摘要 |
Methods of using a hybrid mask composed of a first water soluble film layer and a second water-soluble layer for wafer dicing using laser scribing and plasma etch described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a hybrid mask above the semiconductor wafer. The hybrid mask is composed of a first water-soluble layer disposed on the integrated circuits, and a second water-soluble layer disposed on the first water-soluble layer. The method also involves patterning the hybrid mask with a laser scribing process to provide a patterned hybrid mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The method also involves etching the semiconductor wafer through the gaps in the patterned hybrid mask to singulate the integrated circuits. |
申请公布号 |
WO2015023287(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
WO2013US55213 |
申请日期 |
2013.08.15 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LEI, WEI-SHENG;EATON, BRAD;IYER, APARNA;EGAN, TODD;YALAMANCHILI, MADHAVA RAO;KUMAR, AJAY |
分类号 |
H01L21/301;H01L21/3065 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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