EASILY DEFORMABLE AGGREGATE AND METHOD FOR PRODUCING THE SAME, THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME, AND THERMAL CONDUCTIVE ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a thermal conductive resin composition that has high thermal conductivity, excellent film-formability and excellent substrate-followability when forming a film on a substrate and to provide a thermal conductive member that has high thermal conductivity.SOLUTION: An easily deformable aggregate (D) having an average particle size of 2-100 μm and an average compressive force required for a compression deformation rate of 10% of 5 mN or less comprises 100 pts.mass of a thermal conductive particle (A) having an average primary particle size of 0.1-15 μm and 0.1-30 pts.mass of an organic binder (B). In the easily deformable aggregate (D), the thermal conductive particle (A) is a boron nitride and the organic binder (B) has a nitrogen atom and also has a reactive functional group.