发明名称 |
SMALL FORM FACTOR MAGNETIC SHIELD FOR MAGNETORESTRICTIVE RANDOM ACCESS MEMORY (MRAM) |
摘要 |
Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer positioned above the MRAM cell array, a second ferromagnetic layer positioned below the MRAM cell array, and several vias positioned around at least one MRAM cell. The via comprising a ferromagnetic material. In some implementations, the first ferromagnetic layer, the second ferromagnetic layer and the several vias define a magnetic shield for the MRAM cell array. The MRAM cell may include a magnetic tunnel junction (MTJ). In some implementations, the several vias traverse at least a metal layer and a dielectric layer of the die. In some implementations, the vias are through substrate vias. In some implementations, the ferromagnetic material has high permeability and high B saturation. |
申请公布号 |
US2015048465(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
US201414499027 |
申请日期 |
2014.09.26 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Gu Shiqun;Zhang Rongtian;Ramachandran Vidhya;Kim Dong Wook |
分类号 |
H01L43/12;H01L27/22;H01L43/02 |
主分类号 |
H01L43/12 |
代理机构 |
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代理人 |
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主权项 |
1. A die comprising:
a substrate; at least one dielectric layer; a component; and a plurality of vias positioned at least partially around the component, wherein at least one via from the plurality of vias, comprises a ferromagnetic material. |
地址 |
San Diego CA US |