发明名称 SMALL FORM FACTOR MAGNETIC SHIELD FOR MAGNETORESTRICTIVE RANDOM ACCESS MEMORY (MRAM)
摘要 Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer positioned above the MRAM cell array, a second ferromagnetic layer positioned below the MRAM cell array, and several vias positioned around at least one MRAM cell. The via comprising a ferromagnetic material. In some implementations, the first ferromagnetic layer, the second ferromagnetic layer and the several vias define a magnetic shield for the MRAM cell array. The MRAM cell may include a magnetic tunnel junction (MTJ). In some implementations, the several vias traverse at least a metal layer and a dielectric layer of the die. In some implementations, the vias are through substrate vias. In some implementations, the ferromagnetic material has high permeability and high B saturation.
申请公布号 US2015048465(A1) 申请公布日期 2015.02.19
申请号 US201414499027 申请日期 2014.09.26
申请人 QUALCOMM Incorporated 发明人 Gu Shiqun;Zhang Rongtian;Ramachandran Vidhya;Kim Dong Wook
分类号 H01L43/12;H01L27/22;H01L43/02 主分类号 H01L43/12
代理机构 代理人
主权项 1. A die comprising: a substrate; at least one dielectric layer; a component; and a plurality of vias positioned at least partially around the component, wherein at least one via from the plurality of vias, comprises a ferromagnetic material.
地址 San Diego CA US