ENGINEERED SUBSTRATES HAVING MECHANICALLY WEAK STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

摘要

Engineered substrates having mechanically weak structures for separating substrates from epitaxially grown semiconductor structures and associated systems and methods are disclosed herein. In several embodiments, for example, an engineered substrate can be manufactured by forming an intermediary material at an upper surface of a structural material and forming a plurality of pores in the intermediary material. The porous intermediary material and the structural material can define a handle substrate. The method can further include bonding an epitaxial formation structure on the handle substrate such that the porous intermediary material is between the epitaxial formation structure and the structural material. In various embodiments, the porous intermediary material is configured to break under mechanical stress.

主权项

1. A method of forming an engineered substrate, comprising:
forming a handle substrate having a structural material and an intermediary material at an upper surface of the structural material, wherein the intermediary material has a plurality of pores; and bonding an epitaxial formation structure on the handle substrate, wherein the porous intermediary material is between the epitaxial formation structure and the structural material, and wherein the porous intermediary material is configured to break under mechanical stress.