发明名称 PATTERN EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a pattern exposure method capable of highly accurate processing.SOLUTION: In a pattern exposure method, a long sheet substrate having flexibility is carried in a longitudinal direction, and a pattern for electronic devices is exposed on a surface to be processed of the sheet substrate. The method includes: a step in which each of two positions on the sheet substrate, which are apart in a longitudinal direction by a distance L, are supported by a guide member, and tensile force in a longitudinal direction is given to the distance L portion of the sheet substrate such that an area between the two positions contracts in a shorter direction orthogonal to a longitudinal direction at a predetermined level; a step in which a part of a surface on the rear side of the surface to be processed of the sheet substrate is supported by a substrate support member between the two positions; and a step in which the pattern for electronic devices is exposed in an exposure region which is set on the surface to be processed of the sheet substrate that is supported by the substrate support member in the contracted state at the predetermined level.
申请公布号 JP2015034989(A) 申请公布日期 2015.02.19
申请号 JP20140181202 申请日期 2014.09.05
申请人 NIKON CORP 发明人 HORI MASAKAZU;NARA KEI;YOKOTA MUNEYASU
分类号 G03F7/20;B65H20/02;B65H20/14;B65H23/192;G03F9/00;H01L21/677 主分类号 G03F7/20
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