| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem of a conventional collet that there is a risk of damaging a die when mounting on an intermediate stage, and deteriorating a DAF, and to provide a collet and a die bonder where the die is not damaged nor the DAF is deteriorated when the die is picked up from a wafer and mounted on an intermediate stage.SOLUTION: A collet has a flat suction surface for sucking the upper surface of a die, and a collet tip having a leg surrounding the side face of the die thus sucked. Depth of the leg at the collet tip is larger than the thickness of the die.</p> |
