发明名称 ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of reducing thermal interference from a heating component to another component with a simple structure.SOLUTION: A leaf spring 11 disposed in a waterproof space 5 is vibrated (as depicted with an arrow A) accompanying the vibration of an engine ECU 1, so that a forced convection flow (depicted with an arrow B) is generated toward a connector 9 through a heating component 8a. With this, air in the waterproof space 5 heated by the heating component 8a is pushed to the connector 9 side, to enable enhancing heat exchange efficiency between the heating component 8a and the connector 9. Thus, an excessive high temperature of the heating component 8a is prevented, so that an influence on a low heat resistant component 8b caused by thermal interference from the heating component 8a can be prevented.</p>
申请公布号 JP2015035544(A) 申请公布日期 2015.02.19
申请号 JP20130166574 申请日期 2013.08.09
申请人 DENSO CORP 发明人 UEDA KOJI
分类号 H05K7/20 主分类号 H05K7/20
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