发明名称 ELECTROCONDUCTIVE PARTICLE, CIRCUIT CONNECTING MATERIAL, MOUNTING BODY, AND METHOD FOR MANUFACTURING MOUNTING BODY
摘要 An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.
申请公布号 US2015047878(A1) 申请公布日期 2015.02.19
申请号 US201314386707 申请日期 2013.03.22
申请人 DEXERIALS CORPORATION 发明人 Tamaki Takeshi;Tanaka Yoshito
分类号 H01B1/02;H01B1/22 主分类号 H01B1/02
代理机构 代理人
主权项 1. An electroconductive particle comprising: an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy; and a surface layer made of nickel or a nickel alloy, and formed on the electroconductive layer.
地址 Tokyo JP