发明名称 |
ELECTROCONDUCTIVE PARTICLE, CIRCUIT CONNECTING MATERIAL, MOUNTING BODY, AND METHOD FOR MANUFACTURING MOUNTING BODY |
摘要 |
An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided. |
申请公布号 |
US2015047878(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
US201314386707 |
申请日期 |
2013.03.22 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
Tamaki Takeshi;Tanaka Yoshito |
分类号 |
H01B1/02;H01B1/22 |
主分类号 |
H01B1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electroconductive particle comprising:
an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy; and a surface layer made of nickel or a nickel alloy, and formed on the electroconductive layer. |
地址 |
Tokyo JP |